Hi guys, Can any one share your experience with the increase amount of dross production from your lead-free wave operation? I'm using SN100C alloy on an air atmosphere. I'm seeing 84% of the solder used turning to dross (6.2:1 efficiency ratio). In my study, I weighted the loaded board prior to and after wave solder to determine the amount of solder on each PCBA, and compared the amount of solder used to replenish the pot with the aggregate amount of solder required on 15K units. The difference correlates with the amount of dross produced. I'd like to understand how much of this increase is attributed to the lead-free technology and how much to the equipment performance. Thanks for your help. Miguel Vallejo Mfr Engineer --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------