10 yeers ugo I cuudent eevin sphehl injuneer, now I ahr wun...
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Thursday, August 31, 2006 6:58 AM
To: [log in to unmask]
Subject: Re: [TN] Does anyone else on Technet find this situation beyond c omprehension?
You opened my eyes, sir. The aquestionable grammar does not change the content per se, but a professional group like IPC should not spread papers worldwide, papers that would not pass a college teacher's examination. I could add this: ...'intended to set requirements for ISn deposit thickness ..' .
As far as I understand, deposit thickness is far from the only important parameter!
I might give more example, but not being english (but I'm anglofil!) I stop here...may otherwise be judged posh.
Still, I like the technical content of the paper, and I will use it and recommend it despite the incorrectness.
Inge
----- Original Message -----
From: "Brian Ellis" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, August 31, 2006 12:48 PM
Subject: Re: [TN] Does anyone else on Technet find this situation beyond c omprehension?
Just take the first two paragraphs, my comments in square brackets[]:
1.1 Scope
This specification sets the requirements for the use of Immersion Tin
(ISn) as a surface finish for printed circuit boards. This specification [repeated] is intended to set requirements [repeated] for ISn deposit thickness based on performance criteria. It is intended [repeated] for use by supplier[s], manufacturer[s], contract manufacturer[s] (CM) and original equipment manufacturer[s] (OEM).
1.2 Description
ISn is a metallic finish deposited by a chemical displacement reaction that [the reaction???] is applied directly over the basis [basis is a noun, not an adjective, should be base] metal of the PWB, i.e copper.
Primarily used as a solderable surface. [Not even a sentence, no verb] It has been used in press fit connections and as the interface for Zero Insertion Force (ZIF) edge connectors.
Then you have such atrocities as incorrect use of apostrophes, e.g., The end user shall determine the impact of whisker formation on the reliability of the module in it's [should be its] end use application.
Not to mention incorrect use of registered Trade Marks, such as ...contaminants with an ionograph instrument and reported... [Only the Ionograph (R), and not the OmegaMeter (R), Contaminometer (TM), ZeroIon
(R) etc.????]
And I could cite many more...
I rest my case.
As for the rest, sometimes I see ISn, other times I Sn. Sometimes the values and units are correctly spaced (e.g., 3 µm), sometimes they have no space (e.g. 3µm).
OK?
Brian
Ingemar Hernefjord (KC/EMW) wrote:
> Brian, I use to see your words as kingswords, but in this case I must
> ask you to give an example on the astrociousity, please. My english
> isn't the best, maybe I've something to learn here...offline if you
> prefer that.
> Inge
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
> Sent: den 30 augusti 2006 18:01
> To: [log in to unmask]
> Subject: Re: [TN] Does anyone else on Technet find this situation
> beyond c omprehension?
>
> On the whole, from a quick skim through, I find the doc is intelligible.
> The grammar is atrocious in places and the consistency of terminology
> is poor. A few hours work by a skilled technical editor would bring it
> up to scratch, IMHO.
>
> Brian
>
> Gerard O'Brien wrote:
>> Rudy - I would appreciate it when you decide to slam the work of the
>> committees that you correctly identify the committee you are having a
>> problem with. You say in the first paragraph that you received this
>> message pertaining to your negative vote on the immersion tin
>> standard
>
>> but yet the message from Tom pertains to the 003B solderability
> standard.
>> As co-chairman of the committee responsible for the immersion tin
>> standard I would like to point out that a) you are not on the mailing
>> list, b) we did not receive a negative vote from you.
>>
>>
>> Regards
>>
>> Gerard O'Brien
>> Co-chairman of 4-14
>>
>>
>>
>> -----Original Message-----
>> From: R Sedlak [mailto:[log in to unmask]]
>> Sent: Tuesday, August 29, 2006 9:35 PM
>> To: [log in to unmask]
>> Subject: [TN] Does anyone else on Technet find this situation beyond
>> comprehension?
>>
>> Just in case anyone still has any remaining hopes that the IPC
>> might actually someday attempt to achieve something worthwhile, or
>> perhaps attempt to minimize the confusion in our world, I offer this
>> e-mail message which I received from the IPC in response to my
>> negative vote on the proposed Immersion Tin standards.
>>
>> It is important to realize, to get the full flavor of this message,
>> that the standard was submitted to me for my review with two options:
> 1. Accept
>> as written, or 2. reject, with reasons given for rejection. I
> rejected,
>> because the standard was written in a way which was essentially
>> unintelligible, and I could not even figure out what they were trying
>> to say.
>> I received the following message in return.
>>
>>
>> ---------------------------------
>>
>> From: Tom Newton [mailto:[log in to unmask]]
>> Sent: Tuesday, August 29, 2006 6:46 AM
>> To: Rudy Sedlak
>> Subject: Your Negative Vote Submitted Against IPC J-STD-003B
>>
>>
>> Rudy Sedlak:
>>
>> The IPC 5-23a Printed Wiring Board Solderability Specification Task
>> Group is in the final stages of resolving all Technical Comments for
>> the initial Ballot or potential upcoming Negative Vote Resolution
>> Ballot on IPC J-STD-003B, Solderability Tests for Printed Boards
>> document. Sadly, this is admittedly a
>> very long time since the original Ballot was closed at the end of
>> June 2006.
>>
>> Never-the-less, I am now responding back to you on your Negative
>> Vote submitted on June 26, 2006.
>>
>> Please note that I have attached this response to the full string
>> of
>
>> E-mail correspondence we have had on this document, so that the 'history'
>> of these
>> communications is recorded.
>>
>> Your vote on the ballot for IPC J-STD-003B will be shown as having
>> been submitted toward the Ballot on IPC J-STD-003B. That is, IPC
>> will
> show that
>> you did reply to the Ballot.
>>
>> However, because the following statement:
>> "The wording is so difficult to understand and convoluted, and it
>> is
>
>> so verbose, it is essentially unintelligible. (And if I am offending
>> key people, I apologize, but somebody has to draw a line in the
> sand.)"
>> that was provided as your sole support for your Negative Vote does
>> not contain at least one specific technical detail with a suggested
>> technical solution, your negative vote will not be accepted by the
> 5-23a Task Group.
>> This response will be duly recorded with all of the actions
>> concerning the IPC Ballot for the IPC J-STD-003B document.
>> Additionally, if IPC has communication with the American National
>> Standards Institute (ANSI) on this document, your vote will be shown as an "Unsupported Negative Vote"
>> (one of ANSI's vote categories).
>>
>> Accordingly, IPC thanks you for your ballot submission on IPC
> J-STD-003B.
>> Sincerely,
>>
>> Thomas D. Newton
>> Director PCB Programs, Standards and Technology
>> IPC - Association Connecting Electronics Industries
>> 3000 Lakeside Drive; Suite 309-S
>> Bannockburn, IL 60015
>> Direct: 847-597-2849 Main: 847-615-7100
>> Fax: 847-615-7105
>> E-mail: [log in to unmask] web: www.ipc.org
>>
>>
>>
>>
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