Hi Sue!

Going back across the wave shouldn't be a problem, it won't hurt the
components...been there and done that before...

You seem to be aware that something needs to be done to alleviate your
problem, but you need to take care of the stuff you have in WIP now.

Only other thing that needs to be thought about is if there has been
anything that's been added to the board that might not be able to
withstand a wave/wash process i.e.; unsealed switches etc.. I might
think about taking socketed components out of their sockets before going
back across the wave.

-Steve Gregory-

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Suzanne Runals
Sent: Friday, August 04, 2006 2:26 PM
To: [log in to unmask]
Subject: [TN] Lead Cutting/Fractured Solder Joints

We are experiencing fractured solder joints in our manufacturing
process. We know it is caused from the lead trimming we are doing. We do
not have automated equipment that will cut and clinch the leads.

 I wanted to reflow the boards a second time until we get our process
under control but not everyone agrees with that. They are afraid of
damage to the components caused by the heat of the reflow. Has anyone
else experienced this issue before and what did you temporarily do to
alleviate the problem while working on the real issue of the lead
cutting process. I have tried visual inspection but these boards are
dense boards and we missed some joints and they were returned to us
again by our Customer.

IPC 610 section 7.5.5.8 states you may reflow and it is not considered
rework. However they mention nothing about reliability if we do this.

Thanks
Sue Runals
QA Mgr.

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