One option is to look at UL796 for peel strength. It's a destructive test that is performed at room temperature. You'll have to use your judgment to determine if the technique can be adapted to elevated temperature tests - I suspect not.
I haven't looked to see what's available, but the IPS-TM-650 test methods can be downloaded for free. At the IPC website, http://www.ipc.org/contentpage.asp?PageID=4.1.0.1.1 should get you to the index page. Check it out...I always seem to find a new test technique when there's a need.
Don Vischulis
-----Original Message-----
>From: "Kane, Amol (349)" <[log in to unmask]>
>Sent: Aug 25, 2006 6:29 AM
>To: [log in to unmask]
>Subject: [TN] Copper Pad Peel Strength
>
>Dear Technetters,
>We are having instances where copper pads (Under BGAs) are being lifted off ENIG Boards almost too easily during rework. We use the same thermal profile on each board (for the same component removal) and only some show this phenomenon. Is there a test or standard to test the copper adhesion @ incoming to see whether it's the fab (i.e. are the boards coming to us with poor copper adhesion strength to being with) or the process that's doing this. The board is heated upto 120 C when the component is reflowed for removal. Also, is there data to show the decrease in Cu adhesion strength with temp?
>
>Thanks,
>
>Amol Kane
>M.S (Industrial Eng.)
>Process Engineer
>Harvard Custom Manufacturing, Inc.
>941 Route 38 Owego, NY 13827
>Phone: (607) 687-7669 x349
>[log in to unmask]
>www.harvardgrp.com
>
>
>
>
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