Inge
Great idea. I would add dinner at Rods (if is still open), in one of the
private dinning cars. I may just help George out by making reservation for
him. Betty is most deserving.
Best regards
Lee
J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389
----- Original Message -----
From: "Inge" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, August 25, 2006 1:16 AM
Subject: Re: [TN] LEADFREE BGA ISSUE
> George,
>
> I wish you and your wife many, many more happy years together!
> Now, buy 38 red roses, and give her the best regards from me...
> Whole IPC expect you to do this.
>
> Ingemar
>
>
> ----- Original Message -----
> From: "Wenger, George M." <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Monday, August 21, 2006 2:34 AM
> Subject: Re: [TN] LEADFREE BGA ISSUE
>
>
> Ingemar,
>
> As I get older and closer to real retirement I need to carry copies of
> technical information but I don't need to carry a photograph of the
> woman I've been happily married to for over 38 years.
>
> Regards,
> George
> George M. Wenger
> Andrew Reliability/FMA Engineer
> 40 Technology Drive, Warren, NJ 07059
> (908) 546-4531 [office] (732) 309-8964 [mobil]
> -----Original Message-----
> From: Hfjord [mailto:[log in to unmask]]
> Sent: Sunday, August 20, 2006 3:38 PM
> To: TechNet E-Mail Forum; Wenger, George M.
> Subject: Re: [TN] LEADFREE BGA ISSUE
>
> That is what I've always said to the guys here: Gold is 2358 times
> better to
> solder on than on Nickel.
> To all: consequense of mathematics, not applicable in practice. Except
> from
> my joking, it is, however, a demonstration of the poor solderability of
> Nickel. When soldering on our nickel plated objects, we allow a
> prolonged
> flux activation time and also a longer soldering process.
>
> So, dear George got a soldering dictionary in his wallet while we others
>
> have pic of wife..well, well...
>
> Inge
>
> ----- Original Message -----
> From: "Wenger, George M." <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Friday, August 18, 2006 3:16 PM
> Subject: Re: [TN] LEADFREE BGA ISSUE
>
>
> Dave as usual is correct. Wally's 1969 information is extremely useful.
> I keep a 2" square laminated copy of a portion of Wally's data in my
> wallet:
>
> Element Dissolution Rate (u"/sec.)
> Gold (Au) 117.9
> Silver (Ag) 43.6
> Copper (Cu) 4.1
> Palladium (Pd) 1.4
> Nickel (Ni) 0.05
> Platinum (Pt) 0.01
>
>
> Regards,
> George
> George M. Wenger
> Reliability / FMA Engineer
> Base Station and Subsystems Group
> Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
> [log in to unmask]
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
> Sent: Friday, August 18, 2006 8:48 AM
> To: [log in to unmask]
> Subject: Re: [TN] LEADFREE BGA ISSUE
>
> Hi folks - one reference that was published by Bader in 1969 but is
> still very useful today concerning dissolution rates of metals in solder
> is this
> paper:
>
> W. Bader, "Dissolution of Au, Ag, Pd, Pt, Cu, and Ni in a Molten
> Tin/Lead Solder", Welding Journal 48, pp. 551s - 557s
>
> A "classic" data set that many, many investigators still reference.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
> "Stadem, Richard
> D."
> <Richard.Stadem@G
> To
> D-AIS.COM> [log in to unmask]
> Sent by: TechNet
> cc
> <[log in to unmask]>
>
> Subject
> Re: [TN] LEADFREE BGA ISSUE
> 08/18/2006 07:23
> AM
>
>
> Please respond to
> TechNet E-Mail
> Forum
> <[log in to unmask]>
> ; Please respond
> to
> "Stadem, Richard
> D."
> <Richard.Stadem@G
> D-AIS.COM>
>
>
>
>
>
>
> Amol,
> Sorry about any confusion I caused, what I meant was that
> Klein-Wassink's charts describe the rate of dissolution of nickel into
> molten pure tin, not a tin alloy.
>
> -----Original Message-----
> From: Kane, Amol (349) [mailto:[log in to unmask]]
> Sent: Friday, August 18, 2006 6:50 AM
> To: TechNet E-Mail Forum; Stadem, Richard D.
> Subject: RE: [TN] LEADFREE BGA ISSUE
>
> Hi Richard,
> Not to split hair, but I am a little confused with your statement "the
> information on the dissolution rate of nickel into a tin alloy from
> Klein-Wassink's charts are based on pure tin, not a tin/lead alloy", but
> how can tin be pure if it is in a alloy form with some other metal??
> Am I missing something here?
>
> Regards,
> Amol Kane
> M.S (Industrial Eng.)
> Process Engineer
> Harvard Custom Manufacturing, Inc.
> 941 Route 38 Owego, NY 13827
> Phone: (607) 687-7669 x349
> [log in to unmask]
> www.harvardgrp.com
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard
> D.
> Sent: Thursday, August 17, 2006 1:56 PM
> To: [log in to unmask]
> Subject: Re: [TN] LEADFREE BGA ISSUE
>
> Don't always assume that just because the finish was ENIG, that it was
> the root cause. It may have contributed to it, but usually there is no
> one root cause when this happens.
> Secondly, even when good wetting does take place on ENIG-finished pads,
> upon removal the pads often appear dull. This is just the nature of the
> nickel finish. It does not always indicate a solderability problem with
> the finish.
>
> The problem may have been a reflow profile that was not hot enough, with
> TALT being insufficient to form a good IMF to the nickel base. It is
> slightly more difficult to achieve this with standard 63/37 solder on
> nickel than on copper, and appears to be even more difficult with SAC
> alloy on nickel than on copper. While the temperature is significantly
> hotter, the SAC alloy does not seem to form a good IMF with nickel as
> readily as the 63/37 solder does.
> Werner, the information on the dissolution rate of nickel into a tin
> alloy from Klein-Wassink's charts are based on pure tin, not a tin/lead
> alloy. What is the effect on nickel's dissolution rate when the amount
> of lead in the solder alloy is varied, say from 37% to 0%?
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Colin McVean
> Sent: Thursday, August 17, 2006 9:34 AM
> To: [log in to unmask]
> Subject: Re: [TN] LEADFREE BGA ISSUE
>
> <Certain pads were very dull and when solder is applied on it, it seened
> there was dewetting issue>
>
> Sounds like an issue with the solderability of the ENIG rather than the
> substrate. Check with your PCB fab supplier for their comments.
>
> <By the way, such kind of issue happened only to one customer...>
>
> It only takes one instance of poor process control on ENIG to see faults
> occurring. Looks like this is what has happened in this case.
>
> Rgds
> Colin
>
> Colin McVean M.Inst.C.T.
> Production Manager
> Artetch Circuits Limited
> Main: 01903 725365
> DD: 01903 712926
> Email: [log in to unmask]
> www.artetch.co.uk
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Poh Kong Hui
> Sent: 17 August 2006 15:24
> To: [log in to unmask]
> Subject: Re: [TN] LEADFREE BGA ISSUE
>
> Hi Technetters,
> Could someone advise me the reasons to following issue.
>
> 1. There are total 25 boards for the evaluation purpose.
> 2. Round 1, we assemble d11 units SAC BGA onto board of ENIG. The
> result
> was 10 passed functioonal, 1 piece was not working. There was no signal
> & power to the BGA unit.
>
> 3. Round 2, 4 boards were being assembled, 3 passed, 1 was not
> working
>
> 4. Round 3, 10 boards were biring assembled, 1 was working, 9 not
> working.
>
> The above-stated boards undergo the same temperature profile.
>
> At the beginning, we were suspecting the board of ENIG. When 1 BGA was
> being removed from the failed board, and intend to perform the
> reballing, we realise the not all BGA substrate pads were able to
> solder. Certain pads were very dull and when solder is applied on it, it
> seened there was dewetting issue.
>
> My question is, if the failure of the BGA that was due to BGA's
> substrate or otherwise.
>
> By the way, such kind of issue happened only to one customer...
> Thanks
>
> KH Poh
>
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