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Date: | Tue, 22 Aug 2006 11:35:30 -0700 |
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Nickel-phobia
Amazing how many designers think that nickel will cause cracks. The gold
will bond fine to the copper, in fact the copper will love the gold so
much is will migrate up into the gold and right up to the surface.
You would think you customer would prefer the oxide to immersion nickel
for bond strength.
Chuck Brummer
3M Manufacturing Engineer
8357 Canoga Ave.
Canoga Park, CA 91304-2605
(818) 734-4930
John Parsons <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
08/22/2006 09:02 AM
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Subject
[TN] FAB: Funky PCB Requirements
We are quoting on a PCB which has some unique, at least to us,
manufacturing
requirements and I was hoping that someone might be able to provide
insight
on some of the challenges we foresee.
There are many hurdles to clear with this part, two of which are;
- This 3 layer PCB must have immersion tin plating on all
conductors, inner and outer layers. Does anyone know if the pre-preg will
successfully bond to the immersion tin plated surfaces?
- The outer layers of this part will have areas of selective gold
plating, 50u",plated directly to copper, no nickel interface. Are we
likely
to see problems with bond between the gold and copper?
John Parsons
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