John:  There was an immersion Tin type oxide replacement that bounced around for awhile... it was an immersion Tin, followed by a Silane treatment, and worked quite well.... I have forgotten the name of this process, but at one point a number of shops did it.   I have a suspicion that the number of shops doing this anymore could be counted on one hand...  The last shop I was aware doing this process in our area (Northern CA) went out of business 18+ months ago.

Rudy Sedlak

John Parsons <[log in to unmask]> wrote: We are quoting on a PCB which has some unique, at least to us, manufacturing
requirements and I was hoping that someone might be able to provide insight
on some of the challenges we foresee.



There are many hurdles to clear with this part, two of which are;



-          This 3 layer PCB must have immersion tin plating on all
conductors, inner and outer layers.  Does anyone know if the pre-preg will
successfully bond to the immersion tin plated surfaces?

-          The outer layers of this part will have areas of selective gold
plating, 50u",plated directly to copper, no nickel interface.  Are we likely
to see problems with bond between the gold and copper?



John Parsons




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