Advanced Troubleshooting the PCB Manufacturing Process August 2, 2006 -
Bannockburn, IL
Instructor: Michael Carano, Electrochemicals, Inc.
This course will address advanced problem solving of printed wiring
board defects, and the following topics will be discussed:
* Lamination and other multilayer related defects * Solderability and
assembly issues * Electrodeposition defects: mouse bites, pitting,
nodules, crown or dome plating, dog bone defects * Why assemblers want
to blame the fabricators for defects * Copper plating reliability *
Black pad phenomenon: new details on its cause and how to eliminate it *
How to improve plating distribution and throwing power * Imaging:
defects, surface preparation, soldermask issues and defects, process
control * Metallization: microvoids/voiding, interconnect separation,
hole wall pullaway, glass coverage, metallizing high performance resins,
wedge voids
For more information on this workshop, please cut and paste the
following into your browser:
http://www.ipc.org/calendar/2006/AdvTroubleshooting_0806/Advtroubleshoti
ng_806.htm.
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