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Sender:	TechNet <[log in to unmask]>
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Date:	Wed, 7 Jun 2006 14:11:58 EDT
Reply-To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Subject:	Re: Electrical test Failures on Bare Board Finsihes, in particular OSP
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From:	Werner Engelmaier <[log in to unmask]>
Parts/Attachments:	text/plain (21 lines)

Hi Roland,
The real difference is between nickel layers and all others; the rest of the
surface treatment details are not significant.
The electrical performance when soldering to either Cu or Ni is:
 Cu: 1.67 micro-Ohm/cm; 0.6 micro-Db/cm
 Ni:   90 micro-Ohm/cm; 4.7 micro-Db/cm



Werner

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