Hi Roland,
The real difference is between nickel layers and all others; the rest of the
surface treatment details are not significant.
The electrical performance when soldering to either Cu or Ni is:
 Cu: 1.67 micro-Ohm/cm; 0.6 micro-Db/cm
 Ni:   90 micro-Ohm/cm; 4.7 micro-Db/cm



Werner

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