We used a Proflow head for a couple of years back in 2000-2002 and
finally got rid of it.  The head tended to plug up too often for our
liking. We made a custom aluminum spacer to put in the head to limit the
amount of solder in it so it would not dry out before we had to refill.
That improved the process but we ended up getting rid of the Proflow
head and went back to normal squeegees after a year of that. Hope this
helps.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Monday, May 01, 2006 2:02 PM
To: [log in to unmask]
Subject: [TN] Pump printing

Hi Technetters,

I wonder what your experiences are with this kind of technology, i.e.
Proflow head from DEK or Rheopump from MPM.

I have a high mix low volume application (250 different assemblies with
lot quantities between 5 and 20). The assemblies are ranging from low
complexity (a few SMT passives and an IC) up to fairly complex (10"x12",
high density, 0402, 10 mini BGAs).

Will a pump be good for me from the logistic/financial point of view?
What about the viability of these systems, are they OK, no tendency to
break whan you least need it?

Thanks,
Ioan





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