We used a Proflow head for a couple of years back in 2000-2002 and finally got rid of it. The head tended to plug up too often for our liking. We made a custom aluminum spacer to put in the head to limit the amount of solder in it so it would not dry out before we had to refill. That improved the process but we ended up getting rid of the Proflow head and went back to normal squeegees after a year of that. Hope this helps. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan Sent: Monday, May 01, 2006 2:02 PM To: [log in to unmask] Subject: [TN] Pump printing Hi Technetters, I wonder what your experiences are with this kind of technology, i.e. Proflow head from DEK or Rheopump from MPM. I have a high mix low volume application (250 different assemblies with lot quantities between 5 and 20). The assemblies are ranging from low complexity (a few SMT passives and an IC) up to fairly complex (10"x12", high density, 0402, 10 mini BGAs). Will a pump be good for me from the logistic/financial point of view? What about the viability of these systems, are they OK, no tendency to break whan you least need it? Thanks, Ioan --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This e-mail has been scanned by MCI Managed Email Content Service. ______________________________________________________________________ This e-mail has been scanned by MCI Managed Email Content Service. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------