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May 2006

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Subject:
From:
ZLATKO BIJEDIC <[log in to unmask]>
Reply To:
ZLATKO BIJEDIC <[log in to unmask]>
Date:
Sat, 27 May 2006 07:25:03 -0700
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Gold can be "etching resist" for CuCl2/Hcl etching solution, BUT Ni will be etched faster than copper and you as you guess only gold will remine (on panel or in etching solution)

----- Original Message ----
From: Lin Leo <[log in to unmask]>
To: [log in to unmask]
Sent: Saturday, May 27, 2006 3:25:06 AM
Subject: [TN] Electrolytic Ni/Au in DES


Hi,

  Does anyone have experience on electrolytic Ni/Au(Au thickness: ca. 12~20 micro-incheses; Hard gold Au-Co alloy) acting as etching resist in DES(developing-CuCl2/HCl-stripping) process?  Does Au thickness have impact on etching solution attack?

  Thanks

  Leo


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