Gold can be "etching resist" for CuCl2/Hcl etching solution, BUT Ni will be etched faster than copper and you as you guess only gold will remine (on panel or in etching solution) ----- Original Message ---- From: Lin Leo <[log in to unmask]> To: [log in to unmask] Sent: Saturday, May 27, 2006 3:25:06 AM Subject: [TN] Electrolytic Ni/Au in DES Hi, Does anyone have experience on electrolytic Ni/Au(Au thickness: ca. 12~20 micro-incheses; Hard gold Au-Co alloy) acting as etching resist in DES(developing-CuCl2/HCl-stripping) process? Does Au thickness have impact on etching solution attack? Thanks Leo --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ___________________________________________________ 最新版 Yahoo!奇摩即時通訊 7.0,免費網路電話任 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- 打! http://messenger.yahoo.com.tw/