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May 2006

Leadfree@IPC.ORG

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 8 May 2006 09:08:49 -0400
Content-Type:
text/plain
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text/plain (55 lines)
Yannick,
We do it every day with the industry standard SAC 305.  We have had to
over print though. It should not be any more finish specific than any
other process.
Bev
RIM

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Yannick Brisson
Sent: May 8, 2006 8:55 AM
To: [log in to unmask]
Subject: [LF] Intrusive Reflow

Hi, 

        Does anyone have tried intrusive reflow with any king of lead
free material??  I'd like to have your input on that topic.  I'm
wondering if the sames rules applied to SnPb and Lead Free? Do you know
if it is better with a Tin , Silver or Gold plating? Do we need to have
more paste applied to the board to met the IPC standard?

Thank you

Yannick


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