Hi Werner, Joe, J-P, JohnB, IPC LF Listservers,

<I see the LF-reliability issues to be much more important on the PCB side
than the SJ side. Fortunately, it is the soldering processes that cause
the failures; thus, field failures should not significantly increase since
the failures should show up at functional testing/burn-in.>

I agree many will initially stick with their old laminates, so this will
be the first easy failure mechanism to root out. Yet it will still take
much data and consternations to change the laminate for most companies.
Some products will not and have not required a laminate change.

Werner as you know the majority of companies do not do burn in, so this
only applies to a select set of companies that desire long term
reliability.

Yours in Engineering, Dave
YiEngr, MA/NY DDave

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