Is there a consensus among the listserv on using Pb-free comps in a SnPb
assembly?

We are a U.S. OEM claiming exemption to the RoHS directive (design & mfr of
data storage/transfer equipment with no current EU customers) and as
predicted, the supply of SnPb terminated components are drying up with many
of the new design comps not even being offered in SnPb.  Based on the
published work of industry experts and monitoring of the IPC LF & TechNET
listservs, we have decided to “hot solder dip” Pb-free SMT comps with legs
and re-ball Pb-free BGAs (both with Sn~60/Pb~40); vastly increasing the
cost.  Our assemblies are very low volume (5 to 15pcs typ) with a large mix
of complexity and assembly part numbers.

I have queried local contacts in similar industry/situations and received
the deer-in-the-headlight stare.  I have sat through workshops explaining
how uncertain the future is regarding varying interpretations of
reliability – I just thought I was confused before.

My Other Question: What is the opinion of the masses – are we doing our
product unjust harm in an attempt to maintain reliability?  We are willing
to deal with the cost of re-plate/re-ball as long as performance and
reliability are unchanged.

TIA (not the dog)
Loa

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