Hi Camille, IPC LF Listservers,

<Has anyone run into problems using PCBs with ENIG finish in
<regular SnPb IR reflow or wave solder processes?>
<
<I just talked to someone who said that there were industry advisories out
from a couple of companies (maybe Intel & Radisys??) advising against that
mixture of solder & surface finish, but I have not heard anything about
that on either the TechNet or Lead-Free discussion groups, and a Google
search for "SnPb solder ENIG finish" didn't turn up any immediate warnings
either.>

NOPE,
If I understand your question ENIG has been used forever on the PCB.
Some due to Black Pad might have just said heck with ENIG rather than
fixing their process problem.

Alternatively, just in case it isn't a PCB issue,
I wrote on LF about Ball Drop which is on the package side of the
interconnection. Here is the link that will hopefully get you to the
article by Ray Prasad in SMT Magazine in October 2005. If it doesn't work
use "Ball Drop" as the search term.

http://smt.pennnet.com/articles/article_display.cfm?
Section=ARCHI&C=Colum&ARTICLE_ID=239034&KEYWORDS=Ball%20Drop&p=35

Yours in Engineering, Dave
YiEngr, MA/NY DDave

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