Franklin

At the 2005 Expo I presented a paper that quantified both of these
measurements in terms of the first principals tensile and shear stresses at
the point of rupture. The peel test produces a simultaneous and essentially
uncontrolled combination of both tensile and shear stresses. Ideally you
would prefer only one of these stress to be present an the extent
measurable. The thermal stress test produces only a shear stress between
layers of materials. The drawback here is that the temperature is dynamic
and consequently the stress changes until the entire package reaches thermal
equilibrium. Of the two I prefer the thermal test, but the drawbacks can be
signoficant.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389


----- Original Message -----
From: "Franklin D Asbell" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, May 31, 2006 8:59 AM
Subject: [IPC-600-6012] Bond Strength -vs- Peel Strength


> I'm curious what everyone's thoughts are regarding relevancy of IPC 6012
> Table 4-4 Bond Strength (IPC-TM-650 2.4.21) testing are? Wouldn't peel
> strength (IPC-TM-650 2.4.8) testing be a better test to perform?  Or at a
> minimum, change the test to include smt lands instead of unsupported
> holes.
>
>
>
> Franklin
>