The Mitsubishi RD07MVS1 is a fairly new MOSFET transistor that is typically
used in RF telecommunications applications in the power amplifier stage of
the RF transmitter.

I'm concerned about the reliability and method of mounting this surface
mounted SLP package on a PCB.

Board materials, mounting, assembly, soldering, thermal, reliability... all
are concerns... Any advice with this one is greatly appreciated.

I found some app notes and data available on the Mitsubishi Chips website...
http://www.mitsubishichips.com/Global/index.html

Even after reading their data on the website I would appreciate talking with
someone else who as actually used this or a similar surface mounted MOSFET
package in an RF application...

Thanks in advance...

Best regards,


Bill Brooks - KG6VVP
PCB Design Engineer, C.I.D.+, C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
Datron World Communications, Inc.
_______________________________________
San Diego Chapter of the IPC Designers Council
Communications Officer, Web Manager
http://dcchapters.ipc.org/SanDiego/
http://pcbwizards.com

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