The Mitsubishi RD07MVS1 is a fairly new MOSFET transistor that is typically used in RF telecommunications applications in the power amplifier stage of the RF transmitter. I'm concerned about the reliability and method of mounting this surface mounted SLP package on a PCB. Board materials, mounting, assembly, soldering, thermal, reliability... all are concerns... Any advice with this one is greatly appreciated. I found some app notes and data available on the Mitsubishi Chips website... http://www.mitsubishichips.com/Global/index.html Even after reading their data on the website I would appreciate talking with someone else who as actually used this or a similar surface mounted MOSFET package in an RF application... Thanks in advance... Best regards, Bill Brooks - KG6VVP PCB Design Engineer, C.I.D.+, C.I.I. Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510 Datron World Communications, Inc. _______________________________________ San Diego Chapter of the IPC Designers Council Communications Officer, Web Manager http://dcchapters.ipc.org/SanDiego/ http://pcbwizards.com --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------