I am currently having a soldering issue with a Samtec SMT connector.  We
are seeing cracks in the solder joints
on the inner row.  The lead of the connector is only the butt end of the
connector pin that makes contact to the PCB.
I have included some specifications:

(Embedded image moved to file: pic18467.jpg)
The lead pulls out of the solder joint very easily in the length direction.
It leaves a crater in the solder deposit.  The
solder is fully wetted to the pad and pin.  If I bend the pin parallel to
the length it comes out of the joint like the joint
is butter.  The pin is gold plated and the board surface is OSP.  I would
think that the PAD should pull up before the
solder joint fails?  Any ideas or help would be greatly appreciated.

Thank You,

Mike Forrester


PS.  Detail pictures enclosed:

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(See attached file: Samtec J1 Connector.xls)