"ID" - DP

There are a lot of issues to consider, like how easy
the flux is to remove, how effective the cleaning process is,
and what kind of flux traps are present in the design.
So you have to test.

J-STD-001 gives you the goods.  In Rev. C it's 
Appendix B, and in Rev. D it's Appendix C.

When we qualified our process, we performed SIR
and ion chromatography, plus a few other things.

Joe Kane
BAE Systems
Johnson City, NY


-----Original Message-----
From: Donald Vischulis [mailto:[log in to unmask]] 
Sent: Thursday, March 09, 2006 5:59 PM
To: [log in to unmask]
Subject: [TN] Cleaning Qualification Question


All

I've been assigned the task of determining if a supplier's current
cleaning process is robust or if additional testing is required to be
able to say that the product is clean enough to provide years of field
use.  The board is a 2-sided Class 3 assembly (95% SMT) with one BGA and
about 1500 other components. The assembly is soldered with a water
soluble flux, it's cleaned in a batch cleaner with DI water, and is
conformal coated.  The current manufacturer is using and Omega meter to
verify the cleanliness of the board after cleaning.

My questions:

Is this process good enough to provide a reliable product in an aircraft
application?
If not what guidance is available to determine what level of process
qualification is needed to answer question #1?

Any help is really appreciated.

Don Vischulis

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