Hello Technet!
I've got a pile of ICs received in tubes, that are MSL 3 and have been
exposed to ambient conditions.  Thus, the parts need to be baked out.
My question is this: if I want to bake them in the tubes (not take them
out of the tubes), what lowered temperature / longer time can I use?
The quantity means it would be very painful to take them out of the
tubes, and I know the tubes won't withstand 90C / 2 days, but the 40C /
28 days alternative per J-STD-033 (body <= 2mm, per table 4-1) is not
great either.  How can I calculate a happy medium between these two
time/temp combinations?

I do know this has come up on Technet before, but I can't find it in
the archive.

Thanks!

regards,

Graham Collins
Process Engineer,
L-3 Communications Electronic Systems Inc.
Halifax
(902) 873-2000 ext 6215

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