Hello Technet! I've got a pile of ICs received in tubes, that are MSL 3 and have been exposed to ambient conditions. Thus, the parts need to be baked out. My question is this: if I want to bake them in the tubes (not take them out of the tubes), what lowered temperature / longer time can I use? The quantity means it would be very painful to take them out of the tubes, and I know the tubes won't withstand 90C / 2 days, but the 40C / 28 days alternative per J-STD-033 (body <= 2mm, per table 4-1) is not great either. How can I calculate a happy medium between these two time/temp combinations? I do know this has come up on Technet before, but I can't find it in the archive. Thanks! regards, Graham Collins Process Engineer, L-3 Communications Electronic Systems Inc. Halifax (902) 873-2000 ext 6215 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------