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Date: | Wed, 23 Nov 2005 09:36:59 -0800 |
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The article indicates that a typical Sn/Pb profile peaks at 220degC. I don't
think anyone should be running Sn/Pb that hot. You don't need to be 40degC
above reflow to form a reliable solder joint. I think a Sn/Pb profile should
max at 205degC.
I wonder if the experimental results would change if he ran a cooler (and in
my opinion more appropriate) profile.
Joel Mearig
Delta Tau Data Systems, Inc.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Wednesday, November 23, 2005 7:07 AM
To: [log in to unmask]
Subject: [TN] Lead Free BGAs
> Tin/Silver BGAs balls forces oven profiles to be increased so
> that the ball collapses and creates a good SJ when using tin/lead
> solder, according to this article.
> Regards,
> Ramon
>
>
> http://www.empf.org/empfasis/jan05/help0105.htm
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