The article indicates that a typical Sn/Pb profile peaks at 220degC. I don't think anyone should be running Sn/Pb that hot. You don't need to be 40degC above reflow to form a reliable solder joint. I think a Sn/Pb profile should max at 205degC. I wonder if the experimental results would change if he ran a cooler (and in my opinion more appropriate) profile. Joel Mearig Delta Tau Data Systems, Inc. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon Sent: Wednesday, November 23, 2005 7:07 AM To: [log in to unmask] Subject: [TN] Lead Free BGAs > Tin/Silver BGAs balls forces oven profiles to be increased so > that the ball collapses and creates a good SJ when using tin/lead > solder, according to this article. > Regards, > Ramon > > > http://www.empf.org/empfasis/jan05/help0105.htm --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------