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Date: | Fri, 11 Nov 2005 07:36:07 -0600 |
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HI Ivan! The purpose of the gold is to "protect" the Pd surface from
reacting with the environment. Pd is a "getter" material and can form a
number of "really neat" surface films, both oxide and/or organic films,
depending on the environment.
Dave Hillman
Rockwell Collins
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Ivanoe Pedruzzi
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GROUP.COM> To
Sent by: TechNet [log in to unmask]
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11/11/2005 04:36 Re: [TN] Gold plated components,
AM what a pain!!
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Ivanoe Pedruzzi
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But Werner,
the 150 A is over Pd, does the Pd have different properties in terms
of oxidization, hence, soldering?
just for my understanding.
THX,
Ivan
Il giorno 10/nov/05, alle ore 23:16, Werner Engelmaier ha scritto:
> I agree that 150 Angstroms of Au "is pretty darn thin"--the problem
> is I see
> most layer thicknesses in the 500 to 1,000 A range. A 150A layer of
> au would
> not protect the Ni from oxidizing.
>
>
>
> Werner
>
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