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October 2005

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Subject:
From:
"Stadem, Richard" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard
Date:
Wed, 26 Oct 2005 12:58:32 -0500
Content-Type:
text/plain
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text/plain (47 lines)
Why does the customer want to switch?
Is ENIG a more appropriate choice for the type of assembly?
Is ENIG a more appropriate choice for the end environment or product
use?
How is the change going to be qualified?

The answers to these questions will put to rest the concerns over the
reliability of the assembly when using ENIG. I would attempt to look
into these things before jumping to ENIG. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eddie Rocha
Sent: Wednesday, October 26, 2005 12:50 PM
To: [log in to unmask]
Subject: [TN] ENIG and brittleness

I have a customer looking to convert over to ENIG but would like to see
information that shows he doesn't need to be concerned with brittle
solder joints. Where could I find this type of information?

Thank you,
Eddie Rocha
South Bay Circuits

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