Why does the customer want to switch? Is ENIG a more appropriate choice for the type of assembly? Is ENIG a more appropriate choice for the end environment or product use? How is the change going to be qualified? The answers to these questions will put to rest the concerns over the reliability of the assembly when using ENIG. I would attempt to look into these things before jumping to ENIG. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Eddie Rocha Sent: Wednesday, October 26, 2005 12:50 PM To: [log in to unmask] Subject: [TN] ENIG and brittleness I have a customer looking to convert over to ENIG but would like to see information that shows he doesn't need to be concerned with brittle solder joints. Where could I find this type of information? Thank you, Eddie Rocha South Bay Circuits --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------