Thanks - here's the link for everyone:
http://www.onsemi.com/pub/docs/pcn/15026.pdf
Regards,
Chris
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Gilbert, Doug
Sent: 17 October 2005 15:02
To: [log in to unmask]
Subject: Re: [LF] ONSEMI backward compatibility
James,
I just received the information on the ON Semi announcement from my
boss.
It was "ON Semiconductor General Announcement #15026". It contains the
following:
ON Semiconductor's Pb-free products are backward compatible to 210oC.
Backward compatibility refers to the ability of the Pb-free products to
be
mounted to a PCB with solder pastes containing Pb. Backward
compatibility
does not extend to TO3 and TO92 products as well as Pbfree bump
terminations
found on Flip Chip and BGA. It is recommended that only Pb-free solder
pastes and reflow profiles be used with these Pb-free products.
-----Original Message-----
From: James, Chris [mailto:[log in to unmask]]
Sent: Friday, October 14, 2005 1:39 AM
To: (Leadfree Electronics Assembly Forum); Gilbert, Doug
Subject: FW: ONSEMI backward compatibility
ONSEMI are not aware of any PCN to that affect:
_____
From: ON Help [mailto:[log in to unmask]]
Sent: 13 October 2005 19:01
To: James, Chris
Subject: Re: Pb-F - Service Request #6xxxxxx
Response From ON Semiconductor Service Request #63163
ON Semiconductor Technical Information Center
Phone: 800-282-9855 (US & Canada), +421-337-902910 (EMEA)
Web Site: http://www.onsemi.com/PowerSolutions/supportTechnical.do
****************************************************************
Please do not reply to this email. Please submit any additional
questions via our web site or by calling the ON Semiconductor
Technical Information Center. Thank you.
****************************************************************
Hello C James,
Thank you for contacting ON Semiconductor.
I have no information about the PCN saying that mentioned packages are
not
backward compatible.
ON has conducted reflow tests of Pb-free parts using Pb-containing
solder
reflow temperatures and processes to simulate this condition. Tests have
been conducted at 210 to 230?C and results show that there are no
solderability issues. This does not apply to BGA, bumped die or Flip
Chip
devices; if the parts are Pb-free they need to use a Pb-free reflow
process:
http://www.onsemi.com/PowerSolutions/content.do?id=1282
<http://www.onsemi.com/PowerSolutions/content.do?id=1282>
Regards,
PeterG
ON Semiconductor
Technical Information Center
Subject: Pb-F
Description of customer request:
Have you issued a PCN saying your Pb-free TO-3 and TO-92 packages are
not
backward compatible and should be used for Pb-free soldering only?
_____
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