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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Fri, 14 Oct 2005 09:39:08 +0100 |
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ONSEMI are not aware of any PCN to that affect:
________________________________
From: ON Help [mailto:[log in to unmask]]
Sent: 13 October 2005 19:01
To: James, Chris
Subject: Re: Pb-F - Service Request #6xxxxxx
Response From ON Semiconductor Service Request #63163
ON Semiconductor Technical Information Center
Phone: 800-282-9855 (US & Canada), +421-337-902910 (EMEA)
Web Site: http://www.onsemi.com/PowerSolutions/supportTechnical.do
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Please do not reply to this email. Please submit any additional
questions via our web site or by calling the ON Semiconductor
Technical Information Center. Thank you.
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Hello C James,
Thank you for contacting ON Semiconductor.
I have no information about the PCN saying that mentioned packages are
not backward compatible.
ON has conducted reflow tests of Pb-free parts using Pb-containing
solder reflow temperatures and processes to simulate this condition.
Tests have been conducted at 210 to 230?C and results show that there
are no solderability issues. This does not apply to BGA, bumped die or
Flip Chip devices; if the parts are Pb-free they need to use a Pb-free
reflow process: http://www.onsemi.com/PowerSolutions/content.do?id=1282
Regards,
PeterG
ON Semiconductor
Technical Information Center
Subject: Pb-F
Description of customer request:
Have you issued a PCN saying your Pb-free TO-3 and TO-92 packages are
not backward compatible and should be used for Pb-free soldering only?
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