Subject: | |
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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Thu, 13 Oct 2005 14:39:37 -0400 |
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Pratap,
This example may not apply to this discussion, since in your example
there might have been more than enough Bi to create the ternary alloy.
A 2-4% Bi/remainder Sn mix on a component lead is much thinner than
Sn58Bi coated (not plated, right?) boards. Why in the world would
someone provide Sn52Bi boards is beyond me? Was this a test case to see
what would happen, or was it a production board (very unlikely)?
Doesn't seem to be a real world example, but then again, what do I know?
Turning out to be a top notch discussion! And if anyone runs across any
test results of Bi in Pb-bearing or Pb-free soldering, I would be
interested!
Keep up the good work guys, gals, and whoever's not covered in the first
two!
Roger
-----Original Message-----
From: Pratap Singh [mailto:[log in to unmask]]
Sent: Thursday, October 13, 2005 1:25 PM
To: (Leadfree Electronics Assembly Forum); Roger Stoops
Subject: Re: [LF] Leadfree Processing temp requirement
Hello Dave and Roger
Many good points raised about how Bi may affect solder joint. There is
an interesting summary about this observation on page 215, section
6.6.2 & 6.6.3 Tin Bismuth Solder in the book 'Failure Modes and
Mechanisms in Electronic Packages', Chapman & Hall 1998.. The results
are based on SnBi (42/58 alloy that was plated in PTH as part of the
board finish and a connector was soldered using standard Sn/Pb (63/37)
alloy. Thermal cycle test was 0C-100C and results were catastrophic. As
the cycling proceeded, connectors pins started falling. See pictures
6.60 and 6.61 on pages 216 and 217 of the book. SnPbBi ternary alloy
just oozed out of PTH in a snow flake type of mini balls. There is no
mention of the amount of Bi present in PTH joints
_____________________
pratap singh
Tel./Fax: (512) 255-6820
email: [log in to unmask]
www.rampinc.com
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