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From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Mon, 3 Oct 2005 11:15:01 -0500 |
Content-Type: | text/plain |
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Hi Citronics Carrie,
Hey I am pretty sure I visited your facility. Nice Company Objectives which
reminded me of my IBM days. "Respect for the Individual", , , ,
<It appears that they have changed their tinning solder from a Sn63Pn37
to SAC305.>
<
<What are the reliability concerns when using a wire tinned with SAC305
in a Sn63 hand soldering operation?
My answer will be a bit muddy since that is what we are now dealing with.
iNEMI/NIST-Carol H wrote an article on this earlier this year is one source
for you to review. Carol H's article was more about automated processes yet
hand soldering isn't too far behind.
I see WernerE may have done a workshop at NPL so soon NPL (the UK's
National Physical Laboratory) might also be a better source for
understanding mixing of soldering metalurgies versus reliability across
processes.
If you are in a true high reliability situation, with mixed technologies
(pin in hole, odd balls, smt), you will need specific advice or you will
steer away from mixing metalurgies until more data is available.
Yours in Engineering, Dave
YiEngr, MA/NY DDave
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