Karl,
If you added an attachment, it was stripped out, as usual. Can't do that with LeadNet.
MY opinion? It should be at the component level, but the EU never specifically asked my opinion and I never saw the shotgun request for submissions.
The example the DTI gives is: lead frame, lead finish, overmold, gold wire and IC. I think it would be fair to add the die attach. I HOPE that is as far as it goes, because if they want to go down to the homogeneous level at the IC trace level, then we have even more problems than we have now!
Bev
RIM
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Karl Sauter
Sent: Saturday, October 29, 2005 3:13 PM
To: [log in to unmask]
Subject: Re: [LF] Making IC's RoHS Compliant
Rick,
Since device leads / solder balls can easily be separated from an IC
package, seems like at minimum there should be at least two(2) RoHS
banned material PPM analyses done - one for just the device leads or BGA
solder balls/LGA contacts, then at least one other one for the die
package itself. Both are needed to determine the RoHS compliance status
of an IC.
However some consider an IC to contain many "homogenous materials"
within the package itself: the epoxy, each different metal structure,
the ceramic, and the coatings/finishes.
This opinion is based on a variety of documents published by the EU and
by the UK DTI. Attached is one such example, which is the FAQ published
by the Director General Environment of the EC - page 14 has the definition.
I would like to know the opinion that others hold on this subject?
Thank you.
Regards,
Karl Sauter
Smith, Rick wrote On 10/28/05 11:05,:
> You should find a testing lab like TUV and send some out after you have "RoHSized" them, have them ground up and tested for any traces of the 6 substances and get a report. Then if you are OK with hand solder sounds like you would be covered.
>
> Rick Smith
> Senior Materials & Process Engineer
>
> Phone: (512)652-3544
> Fax: (512)652-3545
> Cell: (512)299-6925
> Email: [log in to unmask]
>
> ClearCube Technology, Inc
> 8834 Capital of Texas Hwy N
> Austin, TX 78759
>
> www.clearcube.com
>
>
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]] On Behalf Of Douglas, Scott
> Sent: Friday, October 28, 2005 11:32 AM
> To: [log in to unmask]
> Subject: Re: [LF] Making IC's RoHS Compliant
>
> No, we cannot consume the inventory, and do not want to make special versions of the product, etc. Also, I do not know about the packaging or innards of the IC's. From everything I have ever seen, the "usual" problem with IC's is the tin-lead solder on the leads. Yeah, lead might be inside soldering the die to the leads (exemption?). But it is probably not in the die itself, and probably not in the plastic package. Typically these IC's are CPLD's or FPGA's or special receivers or something like that. They are not unique to our product. It's just that it will take 3 to 6 man months per IC to design them out and the compliant replacement in, both hardware and software. We are looking to avoid that excessive cost on a number of products. So our thought was could we simply remove the tin-lead solder from the leads and re-plate with something acceptable. Then, to cover the higher soldering temperature, we could hand solder the IC's instead of sending them through the reflow oven
s at the 20-30 degree higher temps. That would certainly be more acceptable than the design side. We could also take some of these "modified" IC's and send them out for testing individually to see where we stood RoHS-wise.
>
> Just wish we could get an exemption from spending that excessive design cycle for a dozen IC's out of hundreds and hundreds of other parts. Looking for another way out...
>
> Thanks for all the comments.
> Scott
>
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]]On Behalf Of Phil Nutting
> Sent: Thursday, October 27, 2005 4:30 PM
> To: [log in to unmask]
> Subject: Re: [LF] Making IC's RoHS Compliant
>
> Scott,
>
> Can you use up the inventory before the July 1 date or are you trying to avoid a board layout change altogether?
>
> Is you chip maker not converting to lead-free? He could be out of business if he does not change.
>
> My 2¢.
>
> Phil
>
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]] On Behalf Of Douglas, Scott
> Sent: Thursday, October 27, 2005 3:38 PM
> To: [log in to unmask]
> Subject: [LF] Making IC's RoHS Compliant
>
> Dear Group,
>
> We are looking for a way to avoid re-designing a number of PWB to replace non-RoHS compliant IC's with other compliant (not drop-in replacement) parts. In a discussion today with our component engineer, we wondered if we could take our stock of non-RoHS compliant IC's, send them to some lab someplace, have them (dip, acid etch, whatever) remove the tin/lead solder plating the leads and then have the leads re-plated with lead-free solder. This assumes a plastic or ceramic package with standard metal leads, maybe through hole, maybe surface mount. Could we do this and then claim to be RoHS compliant? Anything else we should think about in this?
>
> Scott Douglas, NCE
> Compliance Engineer
> Harman Specialty Group
> 3 Oak Park Drive
> Bedford, MA 01730
> Phone: (781) 280-0406
> Email: [log in to unmask]
> Web: www.harmanspecialtygroup.com
>
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