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October 2005

Leadfree@IPC.ORG

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Subject:
From:
"Smith, Rick" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 28 Oct 2005 13:05:22 -0500
Content-Type:
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text/plain (98 lines)
You should find a testing lab like TUV and send some out after you have "RoHSized" them, have them ground up and tested for any traces of the 6 substances and get a report. Then if you are OK with hand solder sounds like you would be covered.

Rick Smith
Senior Materials & Process Engineer
 
Phone: (512)652-3544
Fax:     (512)652-3545
Cell:     (512)299-6925
Email:   [log in to unmask]
 
ClearCube Technology, Inc
8834 Capital of Texas Hwy N
Austin, TX 78759
 
www.clearcube.com
 

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Douglas, Scott
Sent: Friday, October 28, 2005 11:32 AM
To: [log in to unmask]
Subject: Re: [LF] Making IC's RoHS Compliant

No, we cannot consume the inventory, and do not want to make special versions of the product, etc. Also, I do not know about the packaging or innards of the IC's. From everything I have ever seen, the "usual" problem with IC's is the tin-lead solder on the leads. Yeah, lead might be inside soldering the die to the leads (exemption?). But it is probably not in the die itself, and probably not in the plastic package. Typically these IC's are CPLD's or FPGA's or special receivers or something like that. They are not unique to our product. It's just that it will take 3 to 6 man months per IC to design them out and the compliant replacement in, both hardware and software. We are looking to avoid that excessive cost on a number of products. So our thought was could we simply remove the tin-lead solder from the leads and re-plate with something acceptable. Then, to cover the higher soldering temperature, we could hand solder the IC's instead of sending them through the reflow ovens at the 20-30 degree higher temps. That would certainly be more acceptable than the design side. We could also take some of these "modified" IC's and send them out for testing individually to see where we stood RoHS-wise.

Just wish we could get an exemption from spending that excessive design cycle for a dozen IC's out of hundreds and hundreds of other parts. Looking for another way out...

Thanks for all the comments.
Scott

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Phil Nutting
Sent: Thursday, October 27, 2005 4:30 PM
To: [log in to unmask]
Subject: Re: [LF] Making IC's RoHS Compliant


Scott,

Can you use up the inventory before the July 1 date or are you trying to avoid a board layout change altogether? 

Is you chip maker not converting to lead-free?  He could be out of business if he does not change.

My 2¢.

Phil

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Douglas, Scott
Sent: Thursday, October 27, 2005 3:38 PM
To: [log in to unmask]
Subject: [LF] Making IC's RoHS Compliant

Dear Group,

We are looking for a way to avoid re-designing a number of PWB to replace non-RoHS compliant IC's with other compliant (not drop-in replacement) parts. In a discussion today with our component engineer, we wondered if we could take our stock of non-RoHS compliant  IC's, send them to some lab someplace, have them (dip, acid etch, whatever) remove the tin/lead solder plating the leads and then have the leads re-plated with lead-free solder. This assumes a plastic or ceramic package with standard metal leads, maybe through hole, maybe surface mount. Could we do this and then claim to be RoHS compliant? Anything else we should think about in this? 

Scott Douglas, NCE
Compliance Engineer
Harman Specialty Group
3 Oak Park Drive
Bedford, MA 01730
Phone: (781) 280-0406
Email: [log in to unmask] 
Web: www.harmanspecialtygroup.com 

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