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| From: | |
| Reply To: | (Leadfree Electronics Assembly Forum) |
| Date: | Thu, 27 Oct 2005 16:29:38 -0400 |
| Content-Type: | text/plain |
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Scott,
Can you use up the inventory before the July 1 date or are you trying to avoid a board layout change altogether?
Is you chip maker not converting to lead-free? He could be out of business if he does not change.
My 2¢.
Phil
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Douglas, Scott
Sent: Thursday, October 27, 2005 3:38 PM
To: [log in to unmask]
Subject: [LF] Making IC's RoHS Compliant
Dear Group,
We are looking for a way to avoid re-designing a number of PWB to replace non-RoHS compliant IC's with other compliant (not drop-in replacement) parts. In a discussion today with our component engineer, we wondered if we could take our stock of non-RoHS compliant IC's, send them to some lab someplace, have them (dip, acid etch, whatever) remove the tin/lead solder plating the leads and then have the leads re-plated with lead-free solder. This assumes a plastic or ceramic package with standard metal leads, maybe through hole, maybe surface mount. Could we do this and then claim to be RoHS compliant? Anything else we should think about in this?
Scott Douglas, NCE
Compliance Engineer
Harman Specialty Group
3 Oak Park Drive
Bedford, MA 01730
Phone: (781) 280-0406
Email: [log in to unmask]
Web: www.harmanspecialtygroup.com
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