Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Thu, 27 Oct 2005 15:41:25 -0400 |
Content-Type: | text/plain |
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Is the remaining portion of the component already RoHS compliant
(package, "innards", etc)
-Carrie
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Douglas, Scott
Sent: Thursday, October 27, 2005 3:38 PM
To: [log in to unmask]
Subject: [LF] Making IC's RoHS Compliant
Dear Group,
We are looking for a way to avoid re-designing a number of PWB to
replace non-RoHS compliant IC's with other compliant (not drop-in
replacement) parts. In a discussion today with our component engineer,
we wondered if we could take our stock of non-RoHS compliant IC's, send
them to some lab someplace, have them (dip, acid etch, whatever) remove
the tin/lead solder plating the leads and then have the leads re-plated
with lead-free solder. This assumes a plastic or ceramic package with
standard metal leads, maybe through hole, maybe surface mount. Could we
do this and then claim to be RoHS compliant? Anything else we should
think about in this?
Scott Douglas, NCE
Compliance Engineer
Harman Specialty Group
3 Oak Park Drive
Bedford, MA 01730
Phone: (781) 280-0406
Email: [log in to unmask]
Web: www.harmanspecialtygroup.com
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Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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