Dear Wes:
I am currently using a vapor phase soldering machine in my SMT process. It will be great if you could give me more information about your application, so that I can give you more information.
Sincerely,
San
SMT Process Engineer
Marquardt Switches Inc,
Syracuse, NY
Phone: 315-655-8050 Ext 242
Email: [log in to unmask]
Website: www.switches.com

Malewicz Wesley <[log in to unmask]> wrote:
Hello all,

We are currently evaluating an EMS provider who is currently using a Vapor
Phase Reflow system. I am most familiar with the Convection Reflow system
and would like information from any one who can provide me with a pros and
cons between these two types of soldering systems.

Being a Medical products manufacturer, we are concerned that some BGA type
components in the near future will not be available with solder balls
containing Lead. Some new components already are only available as Lead
Free. As a result on new designs, we now have a mix of these types of
components. We are handling this by processing the PCB through the
conventional Lead soldering process and adding the Lead Free BGA components
through a work process.

Any information you can provide on the pros and cons will be appreciated.

Thank you,

Wes

Tel: +1 978-907-7776
Fax: +1 978-907-6489
E-mail: [log in to unmask] >




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Santhakumar Rajesnayagham
Graduate Student & Research Assistant
Center for Electronics Manufacturing and Assembly (CEMA)
Rochester Institute of Technology, Rochester, New York
Phone : (CEMA Lab) 585-475-7293





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