Hello all,

We are currently evaluating an EMS provider who is currently using a Vapor
Phase Reflow system.  I am most familiar with the Convection Reflow system
and would like information from any one who can provide me with a pros and
cons between these two types of soldering systems.

 Being a Medical products manufacturer, we are concerned that some BGA type
components in the near future will not be available with solder balls
containing Lead.  Some new components already are only available as Lead
Free.  As a result on new designs, we now have a mix of these types of
components.  We are handling this by processing the PCB through the
conventional Lead soldering process and adding the Lead Free BGA components
through a work process.

Any information you can provide on the pros and cons will be appreciated.

Thank you,

Wes

Tel: +1 978-907-7776
Fax: +1 978-907-6489
E-mail: [log in to unmask] <mailto:[log in to unmask]
<mailto:[log in to unmask]> >




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