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October 2005

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Subject:
Re: Brd finishing Immersion Gold with BGA. Had black spot issue
From:
No Name <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 21 Oct 2005 12:00:38 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines) 
Adeline,

I would hazard a guess that your ex-colleague was actaully referring to an
Aug 2004 draft version of IPC-7095A "Design and Process Implementation for
BGAs" where the following was mentioned in para 5.3.3:
"Occurrence of the 'black pad' condition does not appear to be sufficiently
common to advise against use of electroless nickel/immersion gold as a
surface finish."

Like what others had mentioned in the thread, the same para attributes the
occurence of black pads to process controls during the PCB coating.

Not sure if anyone could confirm if the same statement exists in the latest
release of IPC-7095A though.

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