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Wed, 19 Oct 2005 12:32:33 -0400 |
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Appears that the copper landing site is lifting from the base material
or plating from the foil. This could be due to poor
planarization/removal or via fill material prior to deposition.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice: 802.257.4571.21 Fax: 802.257.0011
http://www.vtcircuits.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stephen R Gregory
Sent: Wednesday, October 19, 2005 10:30 AM
To: [log in to unmask]
Subject: Re: [TN] Delamination at Thermal Via area?
Hi Wee Mei!
I've got your pictures posted. Go to:
http://www.stevezeva.homestead.com/files/U2_top.JPG
http://www.stevezeva.homestead.com/files/U2_bottom.JPG
http://www.stevezeva.homestead.com/files/U2_delamination.JPG
Are the vias filled? Are you seeing this
delamination on very many
PCB's? Are you seeing it only on the
bottom of the PCB?
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
Wee Mei <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
10/19/2005 03:47 AM
Please respond to TechNet E-Mail Forum
<[log in to unmask]>; Please respond to Wee Mei <[log in to unmask]>
To: [log in to unmask]@SMTP@Exchange
cc: (bcc: Stephen R Gregory/LABARGE)
Subject: [TN] Delamination at Thermal Via area?
Hello,
Just asked Steve to download 3 pictures
on the defects. Kindly take a look
at them and would appreciate some
feedback on the possible root cause.
Steve : Thanks for the downloading.
Regards,
Wee Mei
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