Appears that the copper landing site is lifting from the base material or plating from the foil. This could be due to poor planarization/removal or via fill material prior to deposition. Jeffrey Bush Director, Quality Assurance and Technical Support VERMONT CIRCUITS INCORPORATED 76 Technology Drive - POB 1890 Brattleboro, Vermont 05302 Voice: 802.257.4571.21 Fax: 802.257.0011 http://www.vtcircuits.com -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Stephen R Gregory Sent: Wednesday, October 19, 2005 10:30 AM To: [log in to unmask] Subject: Re: [TN] Delamination at Thermal Via area? Hi Wee Mei! I've got your pictures posted. Go to: http://www.stevezeva.homestead.com/files/U2_top.JPG http://www.stevezeva.homestead.com/files/U2_bottom.JPG http://www.stevezeva.homestead.com/files/U2_delamination.JPG Are the vias filled? Are you seeing this delamination on very many PCB's? Are you seeing it only on the bottom of the PCB? Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX Wee Mei <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 10/19/2005 03:47 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Wee Mei <[log in to unmask]> To: [log in to unmask]@SMTP@Exchange cc: (bcc: Stephen R Gregory/LABARGE) Subject: [TN] Delamination at Thermal Via area? Hello, Just asked Steve to download 3 pictures on the defects. Kindly take a look at them and would appreciate some feedback on the possible root cause. Steve : Thanks for the downloading. Regards, Wee Mei --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- __________________________________________________________________ This message may contain information that is privileged and confidential to LaBarge, Inc. It is for use only by the individual or entity named above. If you are not the intended recipient, you may not copy, use or deliver this message to anyone. In such event, you should destroy the message and kindly notify the sender by reply e-mail. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------