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September 2005

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Subject:
From:
"Barmuta, Mike" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Barmuta, Mike
Date:
Fri, 23 Sep 2005 13:31:35 -0700
Content-Type:
text/plain
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text/plain (131 lines)
Hi Bob: Based on your inputs a two part epoxy is exactly NOT what you want.
You'll never get 'em apart!

You probably won't be able to use a U/V reacted material unless the light
source can actually "see" the adhesive. Without seeing how the bondline and
mating surfaces go together it's hard to say.

If you need a dispensable one part that can be separated after cure then I
would consider something like Loctite 641 Retaining Compound. It's a medium
strength, room temperature cure, one part, dispensable that allows
disassembly. Again I'm not pushing Loctite, just an example.

You could also consider a bonding film such as 3M's or possibly a one
silicone part.



Regards

Mike Barmuta

Staff Engineer

Fluke Corp.

Everett WA

425-446-6076



-----Original Message-----
From: Bob Arciolla [mailto:[log in to unmask]]
Sent: Friday, September 23, 2005 11:52 AM
To: TechNet E-Mail Forum; Barmuta, Mike
Subject: Re: [TN] bonding material


Hi Mike,

Thank you for the input, I am looking to dispense from a EFD dispenser, so
one part preferred. The main reason for bonding is to secure the cover to
the case, but still give the customer access to the unit if necessary. It is
a epoxy cured inverter and the casing is more for RF protection.

Thanks  Bob
----- Original Message -----
From: "Barmuta, Mike" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, September 23, 2005 2:28 PM
Subject: Re: [TN] bonding material


> Bob: In general I would recommend two part epoxy designed for metal
bonding.
> Loctite/Hysol's E-20NS is an example. There are many others available.
> However you do not provide much detail as to the required cured properties
> and environmental exposure. More information could dictate a different
> adhesive type.
>
>
> Regards
>
> Michael Barmuta
>
> Staff Engineer
>
> Fluke Corp.
>
> Everett WA
>
> 425-446-6076
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Bob Arciolla
> Sent: Friday, September 23, 2005 11:09 AM
> To: [log in to unmask]
> Subject: [TN] bonding material
>
>
> Hi all,
>
> I have a unit that we manufacture that has a aluminum case and cover and
was
> wondering if anyone can recommend a bonding material for this and where to
> get it.
> Thanks in advance,
> Bob Arciolla
> Endicott Research Group
>
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