Hi Bob: Based on your inputs a two part epoxy is exactly NOT what you want. You'll never get 'em apart! You probably won't be able to use a U/V reacted material unless the light source can actually "see" the adhesive. Without seeing how the bondline and mating surfaces go together it's hard to say. If you need a dispensable one part that can be separated after cure then I would consider something like Loctite 641 Retaining Compound. It's a medium strength, room temperature cure, one part, dispensable that allows disassembly. Again I'm not pushing Loctite, just an example. You could also consider a bonding film such as 3M's or possibly a one silicone part. Regards Mike Barmuta Staff Engineer Fluke Corp. Everett WA 425-446-6076 -----Original Message----- From: Bob Arciolla [mailto:[log in to unmask]] Sent: Friday, September 23, 2005 11:52 AM To: TechNet E-Mail Forum; Barmuta, Mike Subject: Re: [TN] bonding material Hi Mike, Thank you for the input, I am looking to dispense from a EFD dispenser, so one part preferred. The main reason for bonding is to secure the cover to the case, but still give the customer access to the unit if necessary. It is a epoxy cured inverter and the casing is more for RF protection. Thanks Bob ----- Original Message ----- From: "Barmuta, Mike" <[log in to unmask]> To: <[log in to unmask]> Sent: Friday, September 23, 2005 2:28 PM Subject: Re: [TN] bonding material > Bob: In general I would recommend two part epoxy designed for metal bonding. > Loctite/Hysol's E-20NS is an example. There are many others available. > However you do not provide much detail as to the required cured properties > and environmental exposure. More information could dictate a different > adhesive type. > > > Regards > > Michael Barmuta > > Staff Engineer > > Fluke Corp. > > Everett WA > > 425-446-6076 > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]]On Behalf Of Bob Arciolla > Sent: Friday, September 23, 2005 11:09 AM > To: [log in to unmask] > Subject: [TN] bonding material > > > Hi all, > > I have a unit that we manufacture that has a aluminum case and cover and was > wondering if anyone can recommend a bonding material for this and where to > get it. > Thanks in advance, > Bob Arciolla > Endicott Research Group > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > Quality/Safety Manager > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- > > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------