Well...(here it comes)...that depends...

What is the cause of delamination?

If it is due to entrapped moisture 'perhaps' their method may work, is it
due to poor quality materials? Their method most likely would not work. If
they are saying the boards were not 'cured' therefore additional
lamination/curing is required, then ask "shouldn't this additional cure, not
performed during normal process, now be performed under pressure as well?"
and watch them squirm to answer that question.

Personally I would reject the whole lot and ask for a rebuild...only...only
after they satisfy you with the reason their process failed on the original
lot.

Franklin

-----Original Message-----
From: Mumtaz Bora [mailto:[log in to unmask]]
Sent: Thursday, September 15, 2005 8:21 PM
To: [log in to unmask]
Subject: [TN] Rework for Delaminated PWBs

Dear Technetters,


We have received a large batch of PWBs that is showing delamination after
reflow at peak temp. 230C. Laminate is high Tg - 170C.

Supplier is proposing to perform the following rework -- on these boards
instead of providing replacement parts.

  Oven bake at 190C for 2.5 hours followed by second bake at 150C for 2
hours at 6kg/cm2 pressure. Will this guarantee a full cure?

I am concerned about latent failures and layers opening up as full cure was
not achieved the first time.

Any inputs from the forum will be appreciated.

I will request Steven Gregory to place the image of delamination on his
website.  Have a great weekend.
Thank-you

Mumtaz

  D/ 252 - SMT Process and Component Quality
  Bldg. V238E
Voice  (858)-882-1967
Fax    (858)-882-3126
Page  (858)-635-1180
Cell:   (858) -449-7054
email: [log in to unmask]
Kyocera-Wireless Corp.
10300, Campus Point Drive

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