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Date: | Thu, 15 Sep 2005 18:20:30 -0700 |
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Dear Technetters,
We have received a large batch of PWBs that is showing delamination after
reflow at peak temp. 230C. Laminate is high Tg - 170C.
Supplier is proposing to perform the following rework -- on these boards
instead of providing replacement parts.
Oven bake at 190C for 2.5 hours followed by second bake at 150C for 2
hours at 6kg/cm2 pressure. Will this guarantee a full cure?
I am concerned about latent failures and layers opening up as full cure was
not achieved the first time.
Any inputs from the forum will be appreciated.
I will request Steven Gregory to place the image of delamination on his
website. Have a great weekend.
Thank-you
Mumtaz
D/ 252 - SMT Process and Component Quality
Bldg. V238E
Voice (858)-882-1967
Fax (858)-882-3126
Page (858)-635-1180
Cell: (858) -449-7054
email: [log in to unmask]
Kyocera-Wireless Corp.
10300, Campus Point Drive
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