Ted

majority of shops here in Toronto are depositing from 8 to 19 microinches
silver. and of course the smaller the area on the board - the more it will
plate - if you start hitting the 20 plus range - you have a good chance for
silver migration on the pads...and so on and so on...

you mentioned sunken solder joints on PTH leads - i'd start looking if there
is enogh copper in the through holes. underplated copper will cause blow
holes when reflowed.

regards

Rich Fudalewski
----- Original Message -----
From: "Ted Kong" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, September 09, 2005 1:58 PM
Subject: [TN] Immersion Ag


> Hi Technetter,
>
> According to the fab shops, the recommended immersion
> Ag thickness ranges from 5-25 micro inches.  My
> quesiton is whether having thicker immersion Ag (let
> say around 20 micro inches)would cause PTh solder
> joint defects?  Will it cause sunken solder joint on
> PTH leads?  If so, what is causing this to happen?
>
> Thanks all in advance.
>
> Regards,
>
> Ted Kong.
>
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