Ted majority of shops here in Toronto are depositing from 8 to 19 microinches silver. and of course the smaller the area on the board - the more it will plate - if you start hitting the 20 plus range - you have a good chance for silver migration on the pads...and so on and so on... you mentioned sunken solder joints on PTH leads - i'd start looking if there is enogh copper in the through holes. underplated copper will cause blow holes when reflowed. regards Rich Fudalewski ----- Original Message ----- From: "Ted Kong" <[log in to unmask]> To: <[log in to unmask]> Sent: Friday, September 09, 2005 1:58 PM Subject: [TN] Immersion Ag > Hi Technetter, > > According to the fab shops, the recommended immersion > Ag thickness ranges from 5-25 micro inches. My > quesiton is whether having thicker immersion Ag (let > say around 20 micro inches)would cause PTh solder > joint defects? Will it cause sunken solder joint on > PTH leads? If so, what is causing this to happen? > > Thanks all in advance. > > Regards, > > Ted Kong. > > __________________________________________________ > Do You Yahoo!? > Tired of spam? Yahoo! Mail has the best spam protection around > http://mail.yahoo.com > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------