I have never heard of US cleaning causing cracked solder joints. I have
used US for thousands of assemblies with BGAs, flipchips and uBGA and
CSP components, and have never had any such thing happen. Perhaps I was
lucky. Do you have any documentation to support that general statement? 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Edwards
Sent: Tuesday, August 02, 2005 9:42 PM
To: [log in to unmask]
Subject: Re: [TN] Question on cleaning boards with BGA.

Never use an ultrasonic cleaning system with BGAs unless you want to
generate cracked solder joints...

Assuming your ECN is at the former label location which is why you need
complete adhesive removal... find out from your label supplier what type
of adhesive they are using and have them suggest something...

We use an alcohol/glycol/water mix to remove most label adhesives...

Paul Edwards
Surface Art Engineering


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Harman
Sent: Tuesday, August 02, 2005 4:58 PM
To: [log in to unmask]
Subject: [TN] Question on cleaning boards with BGA.

  We are remanufacturing (reworking some of product) due to an ECR
release.  We apply a label with non-conductive adhesive that once
removed leaves adhesive on the PCBA. This adhesive prevents the board
from passing due to not making contact.  The current process requires an
operator to use IPA and a soft scrub to remove it. This process is time
consuming.  My CM has suggested that we ultrasonic the boards using S-10
solvent. 

 

My boards have BGAs, interconnect pins, and switches along with the
normal SMT parts.  Will using this s-10 solvent in an ultrasonic cleaner
work, and will it not cause any reliability issues with BGAs or other
parts on the boards? 

 

Anyone have any other suggestions for auto cleaning my boards to remove
the adhesive.  We use the no clean process. 
 

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